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december 2009 doc id 16864 rev 1 1/15 15 USBULC1606-4M8 ultra low capacitance esd protection for enhanced mini usb interface features diode array topology d+/d- and id lines protection with 6.8 v low voltage diodes (lv) v bus line protection with 14.6 v high voltage diodes (hv) ultra low capacitance 0.5 pf on low voltage diodes 5 ghz bandwidth at -3 db 1.35 mm width and 0.5 mm height package lead-free package low capacitance between lines to ground for optimized data integrity low pcb space consumption: 2.3 mm2 max foot print high bandwidth low clamping voltage easy layout cea-936-a specification compliant complies with following standards iec 61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) applications where transient over-voltage protection in esd sensitive equipment is required, such as: computers printers communication systems cellular phone handsets and accessories video equipment figure 1. pin configuration (top view) description the USBULC1606-4M8 is an application specific discrete device dedicated to esd protection of an enhanced mini usb interface. the device is ideal for applications where both reduced print circuit board space and power absorption capability are required. micro qfn-8l package 1 2 3 4 8 7 6 5 gnd www.st.com obsolete product(s) - obsolete product(s)
characteristics USBULC1606-4M8 2/15 doc id 16864 rev 1 1 characteristics table 1. absolute maximum ratings t amb = 25 c symbol parameter value unit v pp esd discharge iec 61000-4-2, level 4 contact discharge hv diode contact discharge lv diodes air discharge all pins 15 15 8 kv v lv m ax dc voltage on low-voltage pins 6.0 v v hvmax dc voltage on high-voltage pin (v cc pin) 14.5 v i pp peak pulse current (8/20 s) on high voltage pin (v cc pin) 2.5 a p pp peak pulse power dissipation (8/20 s) on high voltage pin (v cc pin) (1) t j initial = t amb 70 w t j junction temperature 125 c t op operating temperature range -30 to + 85 c t stg storage temperature range -55 to +150 c 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit table 2. electrical characteristics t amb = 25 c, otherwise specified symbol parameter test conditions min. typ. max. unit v f1 + lv diode reverse voltage ? positive voltage i f = 10 ma 6.8 9.2 v v f1 - lv diode forward voltage ? negative voltage i f = 10 ma -1.05 -0.6 v i rm1 low voltage diode leakage current v in = 3.3 v, v n = 0 v t a = -30 to + 65 c 0.1 a rd 1 dynamic resistance of lv diode i pp = 1 a, tp = 8/20 s 1.5 c 1 low voltage diode input capacitance v in = 0 v, v osc = 30 mv f = 1 mhz any i/o pin to v n 0.95 1.1 pf v in = 200 mv, v osc = 200 mv f = 240 mhz any i/o pin to v n 0.5 0.55 v cl1 low voltage diode clamping voltage i pp = 1 a, t p = 8/20 s positive transient negative transient 10 -2.4 v v cl2 high voltage diode clamping voltage i pp = 1 a, t p = 8/20 s i pp = 2.5 a, t p = 8/20 s 21 28 v v f2 + hv diode reverse voltage ? positive voltage i f = 10 ma 14.6 17.7 v obsolete product(s) - obsolete product(s)
USBULC1606-4M8 characteristics doc id 16864 rev 1 3/15 figure 2. s21 attenuation measurement on high speed lines v f2 - hv diode forward voltage ? negative voltage i f = 10 ma -1.5 -0.4 v i rm2 high voltage diode leakage current v in = 11 v, dap grounded 0.1 1.0 a rd 2 dynamic resistance of hv diode i pp = 1 a, t p = 8/20 s 2.8 c 2 high voltage diode input capacitance exposed pad grounded, v in = 2.5 v, f = 1 mhz 10 pf table 2. electrical characteristics t amb = 25 c, otherwise specified (continued) symbol parameter test conditions min. typ. max. unit 100k 1m 10m 100m 1g -6 -5.5 -5 -4.5 -4 -3.5 -3 -2.5 -2 -1.5 -1 -0.5 0 f/hz 100k 1m 10m 100m 1g -6 -5.5 -5 -4.5 -4 -3.5 -3 -2.5 -2 -1.5 -1 -0.5 0 100k db 1m 10m 100m 1g -6 -5.5 -5 -4.5 -4 -3.5 -3 -2.5 -2 -1.5 -1 -0.5 0 f(hz) v = 1.65v in v = 0v in obsolete product(s) - obsolete product(s)
characteristics USBULC1606-4M8 4/15 doc id 16864 rev 1 figure 3. electrical schematic figure 4. typical application table 3. pin configuration typical application pin name type description 1 ch1 i/o lv low-capacitance esd channel 2 ch2 i/o lv low-capacitance esd channel 3 ch3 i/o lv low-capacitance esd channel 4 vcc hv vdd hv esd channel 5 vn negative voltage supply rail 6nc 7nc 8nc ep gnd exposed pad ch1 pin 5 v cc 6.8v 14.6v ep pin 4 v p (internal) ch2 ch3 pin 1 pin 2 pin 3 gnd v n v n gnd v cc high speed data lines channel * exposed pad on back of package (connect to ground) ep* obsolete product(s) - obsolete product(s)
USBULC1606-4M8 characteristics doc id 16864 rev 1 5/15 figure 5. low voltage diode capacitance vs. reverse voltage (typical value) figure 6. low voltage diode capacitance versus frequency (typical value) 0.00 0.50 1.00 1.50 2.00 2.50 3.00 0 0.5 1 1.5 v (v) r c(pf) 0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800 0.900 1.000 0123 frequency(ghz) c (pf) io/gnd v = 30 mv t = 25 c osc rms j obsolete product(s) - obsolete product(s)
characteristics USBULC1606-4M8 6/15 doc id 16864 rev 1 figure 7. esd response to iec 61000-4-2 (+15 kv air discharge) on high speed lines figure 8. esd response to iec 61000-4-2 (-15 kv air discharge) on high speed lines 5.00 v/div 100 ns/div 5.00 v/div 100 ns/div figure 9. esd response to iec 61000-4-2 (+15 kv air discharge) on vcc figure 10. esd response to iec 61000-4-2 (-15 kv air discharge) on vcc 10.0 v/div 100 ns/div 5.00 v/div 100 ns/div figure 11. relative variation of peak pulse power versus initial junction temperature figure 12. peak pulse power versus exponential pulse duration (typical values - v cc pin) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 25 50 75 100 125 150 vcc/gnd p [t initial] / p [t initial=25 c] pp j pp j t j (c) 1 10 100 1000 10000 1 10 100 1000 p (w) pp t (s) p vcc/gnd t initial = 25 c j obsolete product(s) - obsolete product(s)
USBULC1606-4M8 characteristics doc id 16864 rev 1 7/15 figure 15. relative variation of leakage current versus junction temperature (typical values -v cc pin) figure 13. clamping voltage versus peak pulse current (typical values - v cc pin) figure 14. forward voltage drop versus peak forward current (typical values - v cc pin) 0.1 1.0 10.0 14 16 18 20 22 24 26 28 vcc/gnd t initial = 25 c 8/20 s j i (a) pp v (v) cl 0.0 0.1 1.0 10.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 vcc/gnd t initial = 25 c j i (a) fm v (v) fm 1 10 100 1000 25 50 75 100 125 vcc/gnd v = 11v r i [t ]/i [t = 25 c] rjrj t j (c) figure 16. eye diagram pcb only 400 mv amplitude, f = 480 mbps figure 17. eye diagram pcb + usbulc106- 4m8 400 mv amplitude, f = 480 mbps obsolete product(s) - obsolete product(s)
ordering information scheme USBULC1606-4M8 8/15 doc id 16864 rev 1 2 ordering information scheme figure 18. ordering information scheme usb ulc 1606 ?4 m8 usb protection ultra low capacitance breakdown voltage 1606 = dual voltage 14.6 volts min and 6.8 v min number of lines 4 = 4 lines package m8 = qfn- 8l obsolete product(s) - obsolete product(s)
USBULC1606-4M8 package information doc id 16864 rev 1 9/15 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 4. micro qfn 1.7 x 1.35 package dimensions ref dimensions millimeters inches min typ max min typ max a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.025 0.05 0.00 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 d 1.60 1.7 1.80 0.063 0.067 0.071 d2 1.10 1.2 1.30 0.043 0.047 0.051 e 1.25 1.35 1.45 0.050 0.053 0.057 e2 0.30 0.40 0.50 0.012 0.016 0.020 e 0.40 0.016 k 0.17 0.007 l 0.15 0.25 0.35 0.006 0.010 0.014 a a1 e d d2 e b k e2 l pin 1 index area obsolete product(s) - obsolete product(s)
package information USBULC1606-4M8 10/15 doc id 16864 rev 1 figure 21. micro qfn-8l tape and reel specifications note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 19. foot print recommendations (dimensions in mm) figure 20. marking 0.4 0.2 0.45 0.225 1.4 1.75 0.4 1.2 pin 1 16 pin 1 16 user direction of unreeling all dimensions in mm 4.0 0.1 4.0 0.1 2.0 0.05 8.0 0.3 1.75 0.1 3.5 - 0.05 ? 1.55 0.05 0.60 0.05 1.60 0.10 0.30 0.05 1.95 0.10 16 16 16 16 16 16 16 16 16 16 16 16 obsolete product(s) - obsolete product(s)
USBULC1606-4M8 recommendation on pcb assembly doc id 16864 rev 1 11/15 4 recommendation on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 22. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for central exposed pad: opening to footprint ratio is 50%. c) stencil opening for leads: opening to footprint ratio is 90%. figure 23. recommended stencil window position l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 200 m 190 m 12.5 m 12.5 m 5m 5m 1200 m 400 450 m 425 m m 960 m m 120 m 120 240 m 80 m 80 m footprint stencil windo w footprint 0.4 0.2 0.45 0.225 1.4 1.75 0.4 1.2 obsolete product(s) - obsolete product(s)
recommendation on pcb assembly USBULC1606-4M8 12/15 doc id 16864 rev 1 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder paste with fine particles: powder particle size is 20-45 m. 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. obsolete product(s) - obsolete product(s)
USBULC1606-4M8 recommendation on pcb assembly doc id 16864 rev 1 13/15 4.5 reflow profile figure 24. st ecopack? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max obsolete product(s) - obsolete product(s)
ordering information USBULC1606-4M8 14/15 doc id 16864 rev 1 5 ordering information 6 revision history table 5. ordering information order code marking package weight base qty delivery mode USBULC1606-4M8 16 (1) 1. the marking can be rotated by 90 to differentiate assembly location qfn 3.43 mg 3000 tape and reel (7?) table 6. document revision history date revision changes 03-dec-2009 1 initial release. obsolete product(s) - obsolete product(s)
USBULC1606-4M8 doc id 16864 rev 1 15/15 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com obsolete product(s) - obsolete product(s)

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